Wafer Processing Products
ELECTRO-STATIC CHUCK
Materials: Aluminum Nitride, Alumina and Sapphire
Applications: Wide Range, Low and High Temperature
Features:
- Excellent Thermal Conductivity and Uniformity
- High Chucking Force Regardless of Thickness
- High Dielectric Constant
- High Wear Resistance
DOME AND CHAMBER LINER
Materials: Alumina, Silicon Carbide and Aluminum Nitride
Applications: Etch, CVD and PVD
Features:
- Plasma Durability
- Less Metal Contamination
- Available in Any Size and Shape
LARGE PARTS FOR LCD PROCESSING EQUIPMENT
Material: Alumina
Features:
- High Purity
- Reliability
- Available in Large Custom Sizes
END EFFECTORS
Material: Alumina
Features:
- High Rigidity
- Excellent Wear Resistance
- Less Backside Particle Contamination
- Available With Various Coatings
ALUMINUM NITRIDE HEATER
Material: 99.9% Aluminum Nitride
Features:
- Excellent Thermal Uniformity
- Rapid Heat Up
- Easy Temperature Control
- Excellent Plasma Durability
- Less Contamination
VACUUM CHUCKS
Materials: Alumina, Silicon Carbide and Aluminum Nitride
Features:
- Less Backside Particle Contamination
- High Rigidity, Excellent Flatness
- Excellent Wear Resistance
- High Chemical Stability
SAPPHIRE PRODUCTS (see Single Crystal Sapphire Products)
Material: Single Crystal Sapphire, 99.99% Purity
Applications: GaAs Carrier Plates, windows, SOS substrates, dummy wafers, microwave plasma tubes and high speed IC chips
Features:
- Transparent
- High Thermal Conductivity
- Excellent Plasma Durabilty
- High Mechanical Strength
ASSEMBLY PRODUCTS
(see Assembly Technology)
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